This is the fully automatic semiconductor probe assembly and test equipment. It features ultra high precision in assembly process and the intelligent inspection of the finished products. This product is one of the most technologically advanced equipment by international standards in this industry, and has been exported to Northern America.
Key Features:
Read more >● Assembly Precision：15um
● UPH:720
● Visual Inspection included
● Spring Force Test
Semi-automatic semiconductor probe assembly equipment
Features:
● Ultra high assembly precision: 15um
● Visual Inspection included
● Spring force test included
● UPH: 500
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Aged wafer equipment upgrade all control hardware & software and operation system, expand data connectivity for industrial 4.0.
Read more >●Dicing Machine
●Slicing Machine
●Grinding Machine
●Scribing Machine
●Wafer size inspection equipment
Wafer equipments integrated in an auto line under one control center, all working process could be monitored on one page.
Wafer lines:
●Wafer Grinding auto line
●Wafer Developer auto line
●Wafer Dicing auto line
●Wafer Stepper Auto line
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