Optoelectronic transmitters and receivers are ultimately connected to digital logic through sophisticated and specialist amplifiers. Despite the considerable thermal power dissipated in the drivers, and the high-temperature sensitivity of many optoelectronic parts, there is a strong motivation toward more intimate levels of integration. This is particularly the case in the rapidly developing field of silicon photonics. As the integration goes more intensive, optoelectronic parts are getting smaller and closer to each other, thus, the assembly and packaging of optoelectronics products becomes even a bigger problem for many manufacturers. Not to mention for industrial mass production, quality, yield and capacity turn to be a huge challenge.

To fulfill these demands in optoelectronics industry, Insight Scientific developed automatic optoelectronics assembly and packaging platform based on our years of strengthened expertise in precision assembly and machine vision. This platform is designed to assemble and package pigtailed BOSA products.