Aged wafer equipment upgrade all control hardware & software and operation system, expand data connectivity for industrial 4.0.

The equipments updated include but not limited to Japan and US made:

●Dicing equipment,

●Slicing Equipment,

●Grinding Machine,

●Scribing Machine,

●Wafer size inspection equipment

Main upgrade features:

●Maintain the original mechanical hardware.

●Replace the old single-chip computer systems with the PC based control systems.

●Upgrade system and control software to run on Win10;

●After the equipment is upgraded, it meets all the performance indicators of the original machine.

●The upgraded machine can access the MES system.