Success in the semiconductor industry depends on creating smaller, faster, and cheaper products. The benefit of being tiny is that more power can be placed on the same chip. The more transistors on a chip, the faster it can do its work. This creates fierce competition in the industry, and new technologies lower the cost of production per chip so that within a matter of months, the price of a new chip might fall 50%.

In the semiconductor sector, on the wafer level, we provide high value wafer equipments upgrade service, furthermore, integrate all these equipments into a modern high efficiency auto line. On the semiconductor component level, our capabilities of machine vision and mechanics act as a game changer, not just visual inspection, but capital equipments like high precision assembly and inspections. This sector, highly customized service are on the menu, so talk to us about your specific requirements.

1. High Precision Assembly

Fully Automatic Spring Probe Assembly Equipment:
All four components for the probe assembly, the top plungers, the barrels, bottom plungers and springs are place into the machine and the machine automatically sorts and assembles them. The quality of the riveted joints of the assembled products is inspected with a vision system and the assembled probes are force tested.

2. High value wafer equipments Upgrade:

Wafer production needs a serial of high-precision machines to work accordingly. Due to its high precision and sophisticated mechanisms, these machines are extremely expensive and always be a big part of the stationary cost for a chip manufacture. Last couple years, we witnessed the 8-inch wafer bloom, whist most chip makers running for bigger size wafer like 12 inch. For smaller wafer size, the semiconductor industry still adapts aged wafer production equipments, because equipment providers are joining the competition of bigger size wafer market. Thus, how to make these old wafer equipments work more stable and efficiently, even more, how to make these aged equipments align with today’s industry 4.0 smart factory turned out to be a huge challenge.

A. Upgrade old wafer production equipments like grinding, dicing saw, stepper and etc.

3. Automation line Integration:

After the upgrade, individual wafer equipments have been enabled the data connection capability, and connected with the center database, for the first time, data chain been successfully set up. With a center control unit, wafer auto line could be set up.