Semi-automatic semiconductor probe assembly equipment
Features:
● Ultra high assembly precision: 15um
● Visual Inspection included
● Spring force test included
● UPH: 500
The components of the incoming parts are pre-assembled and preloaded to two packages. We use a high-speed four-axis robot equipped with high-precision multi-sensor grips to grab these pre-assembled subcomponents.
Under CCD visual guidance, a set of rotary grab devices is equipped to capture top plunger. The device uses a multi-set CCD visual module to ensure accuracy, and the positioning accuracy of each motion link is controlled within 15um.
Updated version for this equipment, please check: Full automatic semiconductor probe assembly.
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